Heat Sink for Assorted BGA, LGA, CPU, ASICs Aluminum 4.0W at 40°C Top Mount

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Heat Sink for Assorted BGA, LGA, CPU, ASICs Aluminum 4.0W at 40°C Top Mount

Specifications

  • Type: Top Mount
  • Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
  • Attachment Method: Thermal Tape, Adhesive (Not Included)
  • Shape: Square, Pin Fins
  • Length: 1.600" (40.64mm)
  • Width: 1.600" (40.64mm)
  • Diameter: -
  • Height Off Base (Height of Fin): 0.522" (13.27mm)
  • Power Dissipation @ Temperature Rise: 4.0W @ 40°C
  • Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 400 LFM
  • Thermal Resistance @ Natural: -
  • Material: Aluminum
  • Material Finish: Black Anodized


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Specification Value
PackageBGA, LGA
No. Of Holes0
FinishBlack Anodized
Size (L" x W" x H")1.60 x 1.60 x 0.52
Thermal Resistance2.0°C/W
Fin StyleSquare Pin Fin
Attachment MethodAdhesive
ColorBlack
Device CooledBGA, LGA
MaterialAluminum
Length1.6 in.
Width1.6 in.
Height0.52 in.


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