Soder-Wick® No Clean is designed to provide fast and safe desoldering without leaving behind flux residues, and it uses an extremely pure, oxygen free copper braid to make a system that optimizes heat transfer to the solder joint. It is coated with a patented low solids organic "No Clean" flux. Soder-Wick® No Clean is provided in an ESD safe package for protection against damage due to static electricity.
Requires little or no post solder cleaning
No corrosive residues
Optimized weave design for faster wicking and heat transfer
Meets DOD Standard 1686, DOD Handbook 263, Static decay provision of MIL-B-81705C