Silicone Heat Sink Compound 6g Squeeze Tube

You may also like:
10-8108 10-8108
GC Electronics
HSC67-6G HSC67-6G
Caig Labs/Deoxit
10-8109 10-8109
GC Electronics
NTE303 NTE303
NTE Electronics
10-8106 10-8106
GC Electronics
1978-DP 1978-DP
Tech Spray

$4.95 ea

Ship on Oct. 15

  • Jameco Part no.: 2246709
  • Manufacturer: Caig Labs/Deoxit
  • Manufacturer no.: HSC67-6G
  • HTS code: 3506100000
  • Electronics Parts Locator
# of units Price
1+ $4.95
5+ $4.49
25+ $3.95

Request a Large Quantity Quote

Silicone Heat Sink Compound 6g Squeeze Tube

Transfer Heat Away from Electronic Components and Parts

Thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical/electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device.

A cooler device allows for more efficient operation and better reliability over the life of the device. Thermally conductive materials act as a thermal "bridge" to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink).

USE: Apply to all mounting and threaded surfaces of the device and chassis.
CONTAINS: Zinc oxide and polydimethyl siloxane.


  • Thermal Conductivity: 0.67 Watts per meter K
  • Specific Gravity: 2.1 @ 25°C
  • Silicone and Zinc Oxides
  • Viscosity: 542000 mPa.s
  • Shelf Life: 60 months


Transfer heat away from heat sinks, transistors, power diodes, semiconductors ballastss & thermocouple wells.

Report a problem
Suggest a product
Specification Value
Volume (fl. oz.)0.21
ColorWhite Paste
Dielectric Constantn/a
Minimum Operating Temperaturen/a
Maximum Operating Temperaturen/a

Report a problem
Suggest a product