The No Clean rosin soldering flux allows soldering of dissimilar and difficult metals. The flux cleans the surface during the soldering process, allowing easy solder wetting and joining. The No Clean former does not leave a corrosive residue, does not require harsh chemicals to remove, and can be cleaned off with merely water.
No-clean formulation does not require harsh chemicals to remove
Can be safely left on PCB after reflow without cleaning
Recommended for PCB repair, rework, multiple electrical and electronic soldering applications