This kit makes de-soldering super fast and easy. Through-hole and surface mount components will come out with ease, and without any wick at all! No more mess and no potential damage to printed circuit boards
Features:
Also works on lead-free solder joints
Removes QFP's, PLCC's, SOIC's, and chip components under 300 degrees Fahrenheit
2.5 feet of this material is able to remove 1250-1500 SMD pins
Includes:
2.5 feet of ChipQuik® removal alloy material
1cc syringe of ChipQuik® no-clean rework paste flux