Transfer Heat Away from Electronic Components and Parts
Thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical/electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device.
A cooler device allows for more efficient operation and better reliability over the life of the device. Thermally conductive materials act as a thermal "bridge" to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink).
USE: Apply to all mounting and threaded surfaces of the device and chassis. CONTAINS: Zinc oxide and polydimethyl siloxane.
Specifications
Thermal Conductivity: 0.67 Watts per meter K
Specific Gravity: 2.1 @ 25°C
Silicone and Zinc Oxides
Viscosity: 542000 mPa.s
Shelf Life: 60 months
Applications
Transfer heat away from heat sinks, transistors, power diodes, semiconductors ballastss & thermocouple wells.
